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ZEONOR Cyclo Olefin Polymer (COP) is an ideal resin for use in 300mm and 450mm FOSB and FOUP containers

SILICON WAFER TRANSPORT AND STORAGE (FOSB / FOUP)

Semiconductor production requires silicon wafers to be kept free of foreign contaminates, including dust, out-gas particles, and moisture. To achieve this, silicon wafers are transported in specially designed wafer handling containers, which protect the wafers during shipping and within the semiconductor fab.

To avoid contamination of the Si wafers, it is critical that the Front Opening Shipping Box (FOSB) and Front Opening Unified Pod (FOUP) containers provide a barrier against moisture. Additionally, it is important that the FOSB and FOUP do not out-gas (release volatiles) from their plastic components that can contaminate the wafer surface. This is especially critical for large wafers (300mm and 450mm) where detects can represent risks to chip performance, chip reliability, yield, and cost.

ZEONOR® Cyclo Olefin Polymer (COP) is an ideal resin for use in 300mm and 450mm FOSB and FOUP containers.

ZEONOR COP provides:

• Low water-vapor transmission rate // Excellent moisture barrier
• Transparent for easy inspection
• Ultra-low amount of out-gassing

Contact Info

Via email: zeonex@zeonchemicals.com

Americas: +1.502.775.2000
Asia: +81.3.3216.1769
Europe: +49.211.5267.0

Charts and Graphs

For additional information, click on the drop down menu.

Product Grade Water Absorption (%) Glass Transition Temperature (°C)
1020R < 0.01 102
1420R < 0.01 136

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EXCELLENT MOISTURE BARRIER

ZEONOR COP is a non-polar, olefin-based resin. It provides an excellent barrier against moisture ingress through the wafer container. In comparison to common resins used for wafer carriers (e.g., polycarbonate – PC), COP provides significantly improved moisture barrier properties.

Drydown Property

LOW OUT-GAS

ZEONOR COP is an ultra-pure resin. In comparison to polycarbonate (PC), ZEONOR COP has significantly less out-gas generation over time.

ZEONOR COP 1420R - Dynamic Headspace Gas Chromatography Mass spectrometer (DHS-GC-MS)

LOWER WAFER CONTAMINATION CONFIRMED BY LEADING UNIVERSITY

Studies conducted by a leading university* confirm that less out-gas corresponds to less contamination on the Si wafer surface.

As the charts below illustrate, ZEONOR COP shows fewer adsorbed molecules on to the Si wafer surface after both elevated temperature exposure and after extended storage time in the FOSB / FOUP.

Thermal Desorption API-MS (TDS-API-MS)
Adsorbed amount chart
Resin species chart
Total amount of adsorbed outgases onto silicon wafers - ZEONOR box vs. PC box
* Reference: IEEE || Semiconductor Manufacturing Symposium 2011 || ISBN 0-7803-6731-6 || http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=963023

The above data are typical properties and should not be construed as specifications for the noted products.